Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

IEC 62148-21:2021 is available as IEC 62148-21:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 62148-21:2021 covers the design guidelines of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages. This second edition cancels and replaces the first edition published in 2019. This edition constitutes a technical revision. This edition includes the following significant technical change with respect to the previous edition: specification of an electric guard band area around the optical terminal area, so as to allow applications with electric signals at higher symbol rates (e.g. 50 Gbaud and 100 Gbaud).

Composants et dispositifs actifs fibroniques - Normes de boîtier de d'interface - Partie 21: Lignes directrices en matière de conception de l’interface électrique des boîtiers PIC utilisant des boîtiers matriciels à billes et à pas fins en silicium (S-FBGA) et des boîtiers matriciels à zone de contact plate et à pas fins en silicium (S-FLGA)

IEC 62148-21:2021 est disponible sous forme de IEC 62148-21:2021 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.
IEC 62148-21:2021 présente les lignes directrices en matière de conception de l’interface électrique destinée aux boîtiers de circuits intégrés photoniques (PIC) utilisant des boîtiers matriciels à billes et à pas fins en silicium (S-FBGA) et des boîtiers matriciels à zone de contact plate et à pas fins en silicium (S-FLGA). Dans le présent document, l’interface électrique destinée au boîtier S-FBGA est présentée à titre informatif. L’objet du présent document est de spécifier de manière adéquate l’interface électrique des boîtiers PIC composés d’émetteurs et de récepteurs optiques qui permettent l’interchangeabilité électrique et mécanique des boîtiers PIC. Cette deuxième édition annule et remplace la première édition parue en 2019. Cette édition constitue une révision technique. Cette édition inclut la modification technique majeure suivante par rapport à l’édition précédente: spécification d’une zone de bande de garde électrique autour de la zone des bornes optiques, de façon à permettre les applications dont les signaux électriques présentent des débits de symboles supérieurs (par exemple 50 Gbd et 100 Gbd).

General Information

Status
Published
Publication Date
21-Apr-2021
Current Stage
PPUB - Publication issued
Start Date
27-May-2021
Completion Date
22-Apr-2021
Ref Project

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IEC 62148-21:2021 - Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
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IEC 62148-21:2021 - Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
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IEC 62148-21
®

Edition 2.0 2021-04
INTERNATIONAL
STANDARD



Fibre optic active components and devices – Package and interface standards –
Part 21: Design guidelines of electrical interface of PIC packages using silicon
fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array
(S‑FLGA)
IEC 62148-21:2021-04(en)

---------------------- Page: 1 ----------------------
THIS PUBLICATION IS COPYRIGHT PROTECTED
Copyright © 2021 IEC, Geneva, Switzerland

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
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3, rue de Varembé info@iec.ch
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Switzerland

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International Standards for all electrical, electronic and related technologies.

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---------------------- Page: 2 ----------------------
IEC 62148-21

®


Edition 2.0 2021-04




INTERNATIONAL



STANDARD



















Fibre optic active components and devices – Package and interface standards –

Part 21: Design guidelines of electrical interface of PIC packages using silicon

fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array

(S‑FLGA)
























INTERNATIONAL

ELECTROTECHNICAL


COMMISSION





ICS 33.180.20 ISBN 978-2-8322-9723-0




  Warning! Make sure that you obtained this publication from an authorized distributor.


® Registered trademark of the International Electrotechnical Commission

---------------------- Page: 3 ----------------------
– 2 – IEC 62148-21:2021 © IEC 2021
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Terminal position numbering . 6
5 Code of package nominal dimensions . 6
6 Symbols and drawings . 6
7 Dimensions and tolerances . 8
Bibliography . 13

Figure 1 – S-FBGA and S-FLGA outline . 7
Figure 2 – Mechanical gauge drawing .
...

IEC 62148-21
®

Edition 2.0 2021-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE


Fibre optic active components and devices – Package and interface standards –
Part 21: Design guidelines of electrical interface of PIC packages using silicon
fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array
(S‑FLGA)

Composants et dispositifs actifs fibroniques – Normes de boîtier et d’interface –
Partie 21: Lignes directrices en matière de conception de l’interface électrique
des boîtiers PIC utilisant des boîtiers matriciels à billes et à pas fins en silicium
(S-FBGA) et des boîtiers matriciels à zone de contact plate et à pas fins en
silicium (S-FLGA)

IEC 62148-21:2021-04(en-fr)

---------------------- Page: 1 ----------------------
THIS PUBLICATION IS COPYRIGHT PROTECTED
Copyright © 2021 IEC, Geneva, Switzerland

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.


Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
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questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez
les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.

IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland

About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform IEC online collection - oc.iec.ch
The advanced search enables to find IEC publications by a Discover our powerful search engine and read freely all the
variety of criteria (reference number, text, technical publications previews. With a subscription you will always
committee, …). It also gives information on projects, replaced have access to up to date content tailored to your needs.
and withdrawn publications.

Electropedia - www.electropedia.org
IEC Just Published - webstore.iec.ch/justpublished
The world's leading online dictionary on electrotechnology,
Stay up to date on all new IEC publications. Just Published
containing more than 22 000 terminological entries in English
details all new publications released. Available online and
and French, with equivalent terms in 18 additional languages.
once a month by email.
Also known as the International Electrotechnical Vocabulary

(IEV) online.
IEC Customer Service Centre - webstore.iec.ch/csc
If you wish to give us your feedback on this publication or
need further assistance, please contact the Customer Service
Centre: sales@iec.ch.


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