SIST EN IEC 62668-2:2019

SLOVENSKI STANDARD
SIST EN IEC 62668-2:2019
01-december-2019
Upravljanje procesov v avioniki - Preprečevanje ponarejanja - 2. del: Ravnanje z
elektronskimi komponentami iz neodobrenih virov (IEC 62668-2:2019)
Process management for avionics - Counterfeit prevention - Part 2: Managing electronic
components from non-franchised sources (IEC 62668-2:2019)
Luftfahrtelektronik-Prozessmanagement - Verhinderung von Produktfälschung - Teil 2:
Handhabung von elektronischen Bauelementen nichtkonzessionierter Herkunft (IEC
62668-2:2019)
Gestion des processus pour l'avionique - Prévention de la contrefaçon - Partie 2: Gestion
des composants électroniques achetés auprès de sources non franchisées (IEC 62668-
2:2019)
Ta slovenski standard je istoveten z: EN IEC 62668-2:2019
ICS:
31.020 Elektronske komponente na Electronic components in
splošno general
49.020 Letala in vesoljska vozila na Aircraft and space vehicles in
splošno general
SIST EN IEC 62668-2:2019 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 62668-2:2019

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SIST EN IEC 62668-2:2019


EUROPEAN STANDARD EN IEC 62668-2

NORME EUROPÉENNE

EUROPÄISCHE NORM
September 2019
ICS 03.100.50; 31.020; 49.060

English Version
Process management for avionics - Counterfeit prevention - Part
2: Managing electronic components from non-franchised sources
(IEC 62668-2:2019)
Gestion des processus pour l'avionique - Prévention de la Luftfahrtelektronik-Prozessmanagement - Verhinderung von
contrefaçon - Partie 2: Gestion des composants Produktfälschung - Teil 2: Handhabung von elektronischen
électroniques achetés auprès de sources non franchisées Bauelementen nichtkonzessionierter Herkunft
(IEC 62668-2:2019) (IEC 62668-2:2019)
This European Standard was approved by CENELEC on 2019-08-13. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2019 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 62668-2:2019 E

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EN IEC 62668-2:2019 (E)
European foreword
The text of document 107/353/FDIS, future edition 1 of IEC 62668-2, prepared by IEC/TC 107
"Process management for avionics" was submitted to the IEC-CENELEC parallel vote and approved
by CENELEC as EN IEC 62668-2:2019.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2020-05-13
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2022-08-13
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 62668-2:2019 was approved by CENELEC as a European
Standard without any modification.

In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60068-2-1 NOTE Harmonized as EN 60068-2-1
IEC 60068-2-30 NOTE Harmonized as EN 60068-2-30
IEC 60115-8 NOTE Harmonized as EN 60115-8

2

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EN IEC 62668-2:2019 (E)
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.

Publication Year Title EN/HD Year
IEC 62239-1 -  Process management for avionics - Management plan - -
- Part 1: Preparation and maintenance of an electronic
components management plan
IEC 62668-1 2019 Process management for avionics - Counterfeit - -
prevention - Part 1: Avoiding the use of counterfeit,
fraudulent and recycled electronic components

3

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IEC 62668-2

®


Edition 1.0 2019-07




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE
colour

inside










Process management for avionics – Counterfeit prevention –

Part 2: Managing electronic components from non-franchised sources




Gestion des processus pour l'avionique – Prévention de la contrefaçon –

Partie 2: Gestion des composants électroniques achetés auprès de sources non

franchisées















INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-7047-9



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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– 2 – IEC 62668-2:2019 © IEC 2019
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms, definitions and abbreviated terms . 7
3.1 Terms and definitions . 7
3.2 Abbreviated terms . 12
4 Technical requirements . 13
4.1 General . 13
4.2 Overview. 14
4.3 Risks associated with purchasing from non-franchised distributors . 15
4.3.1 General . 15
4.3.2 Origin of risks . 15
4.3.3 Quality risks. 15
4.3.4 Industrial risks . 16
4.3.5 Reliability risks . 17
4.3.6 Financial risks . 17
4.3.7 Legal risk . 17
4.4 Reasons to initialize the derogation process . 17
4.4.1 General . 17
4.4.2 Obsolescence notice failure . 17
4.4.3 Allocation . 17
4.4.4 Insufficient end-of-life inventory . 18
4.4.5 Late orders . 18
4.4.6 Minimum order quantity . 18
4.4.7 Technical requirements . 18
4.5 Derogation process . 18
4.5.1 Notification to the OEM . 18
4.5.2 Analysis of alternative solutions . 20
4.5.3 List of approved non-franchised distributors. 21
4.5.4 Non-franchised distributor consultation . 21
4.5.5 Risk analysis . 22
4.5.6 Non-franchised distributor order authorization . 25
4.5.7 Order processing . 26
4.5.8 Incoming processing . 26
4.5.9 Records . 30
4.5.10 Processing during storage and manufacturing . 31
4.5.11 Failed electronic components . 31
Annex A (informative) Flowchart of IEC 62668-1 requirements . 32
Annex B (informative) Example of detailed tests list, linked with risks levels . 34
Annex C (informative) iNEMI assessment methodology and metric development . 42
Annex D (informative) Summary of SAE AS6171 series' proposed test methods under
consideration by SAE International . 43
Bibliography . 51

Figure 1 – Suspect components perimeter . 14

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Figure 2 – Typical derogation process when supplying from non-franchised distribution. 19
Figure 3 – Potential avionics supply chain scenarios and notification feedbacks . 20
Figure A.1 – Flowchart of IEC 62668-1 requirements . 33

Table 1 – Typical procurement risk scenarios and guidance for risk assessment . 23
Table 2 – Typical testing . 29
Table B.1 – Example of detailed revalidation testing of suspect stock . 34
Table D.1 – Summary of SAE AS6171 series test methods (published versions and
those under considerations) . 43

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INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

PROCESS MANAGEMENT FOR AVIONICS –
COUNTERFEIT PREVENTION –

Part 2: Managing electronic components
from non-franchised sources

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62668-2 has been prepared by IEC technical committee 107:
Process management for avionics.
This first edition cancels and replaces the second edition of IEC TS 62668-2 published in
2016. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the second
edition of IEC TS 62668-2:
a) updates to the risk assessment process, including reference to SAE AS6081;
b) updates to the test methods, including reference to the SAE AS6171 test methods
published and in development;
c) updates in line with IEC 62668-1 for definitions and references to DFARS.

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IEC 62668-2:2019 © IEC 2019 – 5 –
This International Standard is to be used in conjunction with IEC 62239-1 and IEC 62668-1.
The text of this International Standard is based on the following documents:
FDIS Report on voting
107/353/FDIS 107/359/RVD

Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 62668 series, published under the general title Process
management for avionics – Counterfeit prevention, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.

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INTRODUCTION
The avionics industry has a responsibility to ensure that all flight equipment produced has a
predicted product life which correlates with the predicted repair and service life to ensure the
public is not endangered. Typically, an original equipment manufacturer (OEM) calculates a
mean time between failure (MTBF) and possibly a mean time to failure (MTTF) prediction.
These calculations assume all components are new, or considered as “unused”, at the point
of introduction into flight use and that no useful component life and/or any “unsafe”
component conditions have been used. It is therefore essential that counterfeit, recycled and
fraudulent components which have had potentially some of their ”useful life” consumed and
which can also be malfunctioning are not purchased for use in aerospace, defence and high
performance (ADHP) industries.

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IEC 62668-2:2019 © IEC 2019 – 7 –
PROCESS MANAGEMENT FOR AVIONICS –
COUNTERFEIT PREVENTION –

Part 2: Managing electronic components
from non-franchised sources


1 Scope
This part of IEC 62668, defines requirements for avoiding the use of counterfeit, recycled and
fraudulent components when these components are not purchased from the original
component manufacturer (OCM) or are purchased from outside of franchised distributor
networks for use in the aerospace, defence and high performance (ADHP) industries. This
practice is used, as derogation, only when there are no reasonable or practical alternatives.
NOTE Typically this document is used in conjunction with IEC 62239-1 and IEC 62668-1, enabling ADHP
industries to manage and avoid the use of counterfeit, recycled and fraudulent components in their supply chains.
Although developed for the ADHP industry, this document can be used by other high-
performance and high-reliability industries, at their discretion.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 62239-1, Process management for avionics – Management plan – Part 1: Preparation and
maintenance of an electronic components management plan
IEC 62668-1:2019, Process management for avionics – Counterfeit prevention – Part 1:
Avoiding the use of counterfeit, fraudulent and recycled electronic components
3 Terms, definitions and abbreviated terms
3.1 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1.1
aftermarket source
reseller which may or may not be under contract with the original component manufacturer
(OCM) or is sometimes a component “re-manufacturer”, under contract with the OCM
Note 1 to entry: The reseller accumulates inventories of encapsulated or non-encapsulated components (wafer
and/or die) whose end of life date has been published by the OCM. These components are then resold at a profit to
fill a need within the market for components that have become obsolete.
[SOURCE: IEC 62668-1:2019, 3.1.1]

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3.1.2
broker
individual or corporate organization that serves as an intermediary between buyer and seller
Note 1 to entry: In the electronic component sector a broker specifically seeks to supply obsolete or hard to find
components in order to turn a profit. To do so it may accumulate an inventory of components considered to be of
strategic value or may rely on inventories accumulated by another. The broker operates within a worldwide
component exchange network.
[SOURCE: IEC 62668-1:2019, 3.1.2]
3.1.3
COTS product
commercial off-the-shelf product
one or more components, assembled and developed for multiple commercial consumers,
whose design and/or configuration is controlled by the manufacturer’s specification or industry
standard
Note 1 to entry: COTS products can include electronic components, subassemblies, or assemblies, or top-level
assemblies. Electronic COTS subassemblies or assemblies include circuit card assemblies, power supplies, hard
drives, and memory modules. Top-level COTS assemblies include a fully integrated rack of equipment such as raid
arrays, file servers to individual switches, routers, personal computers, or similar equipment.
Note 2 to entry: This note applies to the French language only.
[SOURCE: IEC 62668-1:2019, 3.1.3]
3.1.4
counterfeit, verb
action of simulating, reproducing or modifying a material, good or its packaging without
authorization
Note 1 to entry: It is the practice of producing products which are imitations or are fake goods or services. This
activity infringes the intellectual property rights of the original manufacturer and is an illegal act. Counterfeiting
generally relates to willful trademark infringement.
[SOURCE: IEC 62668-1:2019, 3.1.4]
3.1.5
counterfeited component
material good imitating or copying an authentic material, good which may be covered by the
protection of one or more registered or confidential intellectual property rights
Note 1 to entry: A counterfeited component is one whose identity or pedigree has been altered or misrepresented
by its supplier.
Identity = original manufacturer, part number, date code, lot number, testing, inspection, documentation or warranty
etc.
Pedigree = origin, ownership history, storage, handling, physical condition, previous use, etc.
Note 2 to entry: When a material good has no registered or confidential intellectual property rights, then the
material good has no intellectual property protection. Examples include situations where the original component
manufacturer (OCM) has ceased to trade and has not sold or passed on the intellectual property rights to another
entity.
[SOURCE: IEC 62668-1:2019, 3.1.5]
3.1.6
customer device specification
device specification written by a user and agreed by the supplier
[SOURCE: IEC 62668-1:2019, 3.1.6]

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3.1.7
customer
user
original equipment manufacturer (OEM) which purchases electronic components, including
integrated circuits and/or semiconductor devices compliant with this document, and uses them
to design, produce, and maintain systems
[SOURCE: IEC 62668-1:2019, 3.1.7]
3.1.8
data sheet
document prepared by the manufacturer that describes the electrical, mechanical, and
environmental characteristics of the component
[SOURCE: IEC 62668-1:2019, 3.1.8]
3.1.9
franchised distributor or agent
individual or corporate organisation that is legally independent from the franchiser (in this
case the electronic component manufacturer or OCM) and agrees under contract to distribute
products using the franchiser’s name and sales network
Note 1 to entry: Distribution activities are carried out in accordance with standards set and controlled by the
franchiser. Shipments against orders placed can be dispatched either directly from the OCM or the franchised
distributor or agent. In other words, the franchised distributor enters into contractual agreements with one or more
electronic component manufacturers to distribute and sell the said components. Distribution agreements may be
stipulated according to the following criteria: geographical area, type of clientele (avionics for example), maximum
manufacturing lot size. Components sourced through this route are protected by the OCM’s warranty and supplied
with full traceability.
[SOURCE: IEC 62668-1:2019, 3.1.9]
3.1.10
fraudulent component
electronic component produced or distributed either in violation of regional or local law or
regulation, or with the intent to deceive the customer
Note 1 to entry: This includes but is not limited to the following which are examples of components which are
fraudulently sold as new ones to a customer:
1) a stolen component;
2) a component scrapped by the original component manufacturer (OCM) or by any user;
3) a recycled component, that becomes a fraudulent recycled component when it is a disassembled (for example,
disassembled from a PCB assembly) component resold as a new component (see Figure 1), where typically
there is evidence of prior use and rework (for example solder, re-plating or lead re-attachment activity) on the
component package terminations;
4) a counterfeit component, a copy, an imitation, a full or partial substitute of brands;
5) fraudulent designs, models, patents, software, or copyright sold as being new and authentic. For example: a
component whose production and distribution are not controlled by the original manufacturer;
6) unlicensed copies of a design;
7) a disguised component (remarking of the original manufacturer’s name, reference date/code or other
identifiers etc.), which may be a counterfeit component (see Figure 1);
8) a component without an internal silicon die or with a substituted silicon die which is not the original
manufacturer’s silicon die.
[SOURCE: IEC 62668-1:2019, 3.1.10]

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3.1.11
microcircuit
component
device
electrical or electronic device that is not subject to disassembly without destruction or
impairment of design use and is a small circuit having a high equivalent circuit element
density which is considered as a single part composed of interconnected elements on or
within a single substrate to perform an electronic circuit function
Note 1 to entry: This excludes printed wiring boards / printed circuit boards, circuit card assemblies and modules
composed exclusively of discrete electronic components).
Note 2 to entry: A microcircuit is usually referred to as an active component or device. The term component can
be applied to passive devices such as resistors and capacitors. Sometimes the term ‘part’ is also used instead of
the terms ‘microcircuit’, ‘component’ and ‘device’
[SOURCE: IEC 62668-1:2019, 3.1.12, modified – Note 2 has been added.]
3.1.12
MRO
maintenance, repair and overhaul
operations such as tests, measurements, replacements, adjustments and repairs intended to
retain or restore a functional u
...