Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-44: Examinations and measurements - Fibre optic trancsceiver receptacle endface visual and automated inspection

IEC 61300-3-44:2012 describes methods for quantitatively assessing the endface quality of an optic receptacle interface for single mode applications, equipped with transceivers such as SFP/XFP. Keywords: optic receptacle interface

Dispositifs d'interconnexion et composants passifs à fibres optiques - Méthodes fondamentales d'essais et de mesures - Partie 3-44: Examens et mesures - Inspection automatique et visuelle de l'extrémité des embases d'émetteurs-récepteurs à fibres optiques

La CEI 61300-3-44:2012 décrit les méthodes prévues pour évaluer quantitativement la qualité de l'extrémité de l'interface d'embase d'émetteurs-récepteurs à fibres optiques, tels que SFP/XFP, pour des applications en unimodal. Mots clé: l'interface d'embase d'émetteurs-récepteurs à fibres optiques

General Information

Status
Replaced
Publication Date
29-Aug-2012
Current Stage
WPUB - Publication withdrawn
Completion Date
25-Mar-2016
Ref Project

Relations

Buy Standard

Standard
IEC 61300-3-44:2012 - Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-44: Examinations and measurements - Fibre optic trancsceiver receptacle endface visual and automated inspection Released:8/30/2012
English and French language
29 pages
sale 15% off
Preview
sale 15% off
Preview

Standards Content (Sample)

IEC 61300-3-44
®

Edition 1.0 2012-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside


Fibre optic interconnecting devices and passive components – Basic test and
measurement procedures –
Part 3-44: Examinations and measurements – Fibre optic transceiver receptacle
endface visual and automated inspection

Dispositifs d’interconnexion et composants passifs à fibres optiques –
Méthodes fondamentales d’essais et de mesures –
Partie 3-44: Examens et mesures – Inspection automatique et visuelle de
l'extrémité des embases d'émetteurs-récepteurs à fibres optiques

IEC 61300-3-44:2012

---------------------- Page: 1 ----------------------
THIS PUBLICATION IS COPYRIGHT PROTECTED
Copyright © 2012 IEC, Geneva, Switzerland

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.


Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite ni
utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie et les
microfilms, sans l'accord écrit de la CEI ou du Comité national de la CEI du pays du demandeur.
Si vous avez des questions sur le copyright de la CEI ou si vous désirez obtenir des droits supplémentaires sur cette
publication, utilisez les coordonnées ci-après ou contactez le Comité national de la CEI de votre pays de résidence.

IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé Fax: +41 22 919 03 00
CH-1211 Geneva 20 info@iec.ch
Switzerland www.iec.ch

About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.

Useful links:

IEC publications search - www.iec.ch/searchpub Electropedia - www.electropedia.org
The advanced search enables you to find IEC publications The world's leading online dictionary of electronic and
by a variety of criteria (reference number, text, technical electrical terms containing more than 30 000 terms and
committee,…). definitions in English and French, with equivalent terms in
It also gives information on projects, replaced and additional languages. Also known as the International
withdrawn publications. Electrotechnical Vocabulary (IEV) on-line.

IEC Just Published - webstore.iec.ch/justpublished Customer Service Centre - webstore.iec.ch/csc
Stay up to date on all new IEC publications. Just Published If you wish to give us your feedback on this publication
details all new publications released. Available on-line and or need further assistance, please contact the
also once a month by email. Customer Service Centre: csc@iec.ch.


A propos de la CEI
La Commission Electrotechnique Internationale (CEI) est la première organisation mondiale qui élabore et publie des
Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications CEI
Le contenu technique des publications de la CEI est constamment revu. Veuillez vous assurer que vous possédez
l’édition la plus récente, un corrigendum ou amendement peut avoir été publié.

Liens utiles:

Recherche de publications CEI - www.iec.ch/searchpub Electropedia - www.electropedia.org
La recherche avancée vous permet de trouver des Le premier dictionnaire en ligne au monde de termes
publications CEI en utilisant différents critères (numéro de électroniques et électriques. Il contient plus de 30 000
référence, texte, comité d’études,…). termes et définitions en anglais et en français, ainsi que
Elle donne aussi des informations sur les projets et les les termes équivalents dans les langues additionnelles.
publications remplacées ou retirées. Egalement appelé Vocabulaire Electrotechnique
International (VEI) en ligne.
Just Published CEI - webstore.iec.ch/justpublished
Service Clients - webstore.iec.ch/csc
Restez informé sur les nouvelles publications de la CEI.
Just Published détaille les nouvelles publications parues. Si vous désirez nous donner des commentaires sur
Disponible en ligne et aussi une fois par mois par email. cette publication ou si vous avez des questions
contactez-nous: csc@iec.ch.

---------------------- Page: 2 ----------------------
IEC 61300-3-44

®


Edition 1.0 2012-08




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE
colour

inside










Fibre optic interconnecting devices and passive components – Basic test and

measurement procedures –

Part 3-44: Examinations and measurements – Fibre optic transceiver receptacle


endface visual and automated inspection



Dispositifs d’interconnexion et composants passifs à fibres optiques –


Méthodes fondamentales d’essais et de mesures –

Partie 3-44: Examens et mesures – Inspection automatique et visuelle de

l'extrémité des embases d'émetteurs-récepteurs à fibres optiques










INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE

PRICE CODE
INTERNATIONALE

CODE PRIX N


ICS 33.180.20 ISBN 978-2-83220-214-2



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

---------------------- Page: 3 ----------------------
– 2 – 61300-3-44  IEC:2012
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Measurement . 5
2.1 General . 5
2.2 Measurement conditions . 6
2.3 Pre-conditioning. 6
2.4 Recovery . 6
3 Apparatus . 6
3.1 Method A: video microscopy . 6
3.2 Method B: automated analysis microscopy . 6
3.3 Calibration requirements for low and high resolution systems . 6
3.3.1 General . 6
3.3.2 Requirements for low resolution microscope systems . 7
3.3.3 Requirements for high resolution microscope systems . 7
4 Procedure . 7
4.1 Measurement regions . 7
4.2 Calibration procedure . 7
4.3 Inspection procedure . 8
4.4 Visual Requirements . 10
Annex A (normative) Diagram of calibration artefact and method of manufacture . 11
Bibliography . 14

Figure 1 – Inspection procedure flow . 9
Figure A.1 – Example of nano-indentation test system . 11
Figure A.2 – Example of high resolution artefact: Sample of pattern cut into a 125 µm
cladding on the end of a polished SC connector . 12
Figure A.3 – Example of low resolution artefact pattern. 13

Table 1 – Measurement regions . 7
Table 2 – Visual requirements for fibre receptacle interface equipped with transceivers . 10

---------------------- Page: 4 ----------------------
61300-3-44  IEC:2012 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

FIBRE OPTIC INTERCONNECTING
DEVICES AND PASSIVE COMPONENTS –
BASIC TEST AND MEASUREMENT PROCEDURES –

Part 3-44: Examinations and measurements –
Fibre optic transceiver receptacle endface
visual and automated inspection


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61300-3-44 has been prepared by subcommittee 86B: Fibre optic
interconnecting devices and passive components, of IEC technical committee 86: Fibre optics.
The text of this standard is based on the following documents:
FDIS Report on voting
86B/3424/FDIS 86B/3467/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.

---------------------- Page: 5 ----------------------
– 4 – 61300-3-44  IEC:2012
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of IEC 61300 series, published under the general title Fibre optic
interconnecting devices and passive components – Basic test and measurement procedures,
can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until the
stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to
the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
This document is withdrawn when IEC 61300-3-35 Edition 2.0 is published.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

---------------------- Page: 6 ----------------------
61300-3-44  IEC:2012 – 5 –
FIBRE OPTIC INTERCONNECTING
DEVICES AND PASSIVE COMPONENTS –
BASIC TEST AND MEASUREMENT PROCEDURES –

Part 3-44: Examinations and measurements –
Fibre optic transceiver receptacle endface
visual and automated inspection



1 Scope
This part of IEC 61300 describes methods for quantitatively assessing the endface quality of an
optic receptacle interface for single mode applications, equipped with transceivers such as
SFP/XFP. Lens type and stub ferrule type interface configurations are designed for this
interface, but this standard defines the end face quality of the stub ferrule type in this edition.
The information is intended for use with other standards which set requirements for allowable
surface defects such as scratches, pits and debris which may affect optical performance. In
general, the methods described in this standard apply to 125 µm cladding fibres contained
within a ferrule and intended for use with sources of ≤ 2 W of input power.
2 Measurement
2.1 General
The objective of this document is to prescribe methods for quantitatively inspecting fibre optic
endfaces to determine if they are suitable for use. Two methods are described: A: video
microscopy and B: automated analysis microscopy. Within each method, there are hardware
requirements and procedures for both low resolution and high resolution systems. High
resolution systems are to be utilized for critical examination of the glass fibre after polishing
and upon incoming quality assurance. High resolution systems are typically not used during
field polishing or in conjunction with multimode connectors. Low resolution systems are to be
utilized prior to mating connectors for any purpose. All methods require a means for measuring
and quantifying defects.
There are many types of defects. Commonly used terminology would include: particles, pits,
chips, scratches, embedded debris, loose debris, cracks, etc. For practical purposes, all
defects will be categorized in one of two groups. They are defined as follows:
scratches: permanent linear surface features;
defects: all non-linear features detectable on the fibre. This includes particulates, other
debris, pits, chips, edge chipping, etc.
All defects and scratches are surface anomalies. Sub-surface cracks and fractures are not
reliably detectable with a light microscope in all situations and are therefore not covered within
this standard. Cracks and fractures to the fibre may be detected with a light microscope and
are generally considered a catastrophic failure.
Differentiating between a scratch and all other defects is generally intuitive to a human being.
However, to provide clarity, and for automated systems, scratches are defined as being less
than 4 µm wide, linear in nature, and with a length that is at least 30 times their width. As the
width dimension is not practical to measure below 3 µm, these figures can be grossly estimated.
Defects size is defined for method A as the diameter of the smallest circle that can encompass
the entire defect. Defect size for method B can be either the actual measured surface area or

---------------------- Page: 7 ----------------------
– 6 – 61300-3-44  IEC:2012
the diameter of the smallest circle than can encompass the entire defect. For the purposes of
this standard the smallest circle method shall be used.
For method A, it is recommended that visual gauge tools be developed to facilitate the
measurement procedure. In addition, an overlay is recommended.
2.2 Measurement conditions
No restrictions are placed on the range of atmospheric conditions under which the test can be
conducted. It may be performed in controlled or uncontrolled environments
2.3 Pre-conditioning
No minimum pre-conditioning time is required.
2.4 Recovery
Since measurements are to be made at standard test conditions, no minimum recovery time is
required.
3 Apparatus
3.1 Method A: video microscopy
This method utilizes a light microscope in which a lens system forms an image on a sensor
which, in turn, transfers the image to a display. The user views the image on the display. It
shall have the following features and capabilities:
• a suitable ferrule or connector adapter;
• a light source and focusing mechanism;
• a means to measure defects observed in the image.
3.2 Method B: automated analysis microscopy
This method utilizes a light microscope in which a digital image is acquired or created and
subsequently analyzed via an algorithmic process. The purpose of such a system is to reduce
the effects of human subjectivity in the analysis process and, in some cases, to improve cycle
times. It shall have the following features and capabilities:
• a suitable ferrule or connector adapter;
• a means for acquiring or creating a digital image;
• algorithmic analysis of the digital image.
A means to compare the analyzed image to programmable acceptance criteria in such a
manner that a result of “pass” or “fail” is provided.
3.3 Calibration requirements for low and high resolution systems
3.3.1 General
Microscope systems for any of the methods above shall be calibrated for use in either low or
high resolution applications. It is suggested that this calibration be conducted with a purpose-
built calibration artefact that can serve to validate a system’s ability to detect defects of
relevant size. Such an artefact shall be provided with instructions on its use and shall be
manufactured by a method such that it can be measured in a traceable manner. Details on the
manufacture of such artefacts can be found in Annex A.

---------------------- Page: 8 ----------------------
61300-3-44  IEC:2012 – 7 –
For reference, a system’s optical resolution may be calculated using the formula below. Optical
resolution is not equivalent to the system’s detection capability. In most cases, the system will
be able to detect defects smaller than its optical resolution.
Optical resolution = (0,61 × Wavelength of illumination source) / system’s numerical aperture
3.3.2 Requirements for low resolution microscope systems
Minimum total magnification offering a field of view of at least 250 µm (for methods A and B,
this dimension is to be measured in the vertical, or most constrained, axis) capable of detecting
low-contrast defects of 2 µm in diameter or width.
3.3.3 Requirements for high resolution microscope systems
Minimum total magnification offering a field of view of at least 120 µm (for methods A and B,
this dimension shall be measured in the vertical, or most constrained, axis) capable of
detecting low contrast scratches of 0,2 µm in width and 0,003 µm in depth.
4 Procedure
4.1 Measurement regions
For the purposes of setting requirements on endface quality, the polished endface of a
receptacle interface is divided into measurement regions. These regions are concentric with
the fibre OD and are defined in Table 1. If a defect is found to be in more than one zone, it
shall be counted in all zones it touches.
Table 1 – Measurement regions
Zone Diameter
A: core 0 µm to 15 µm
B: 15 µm to 115 µm
cladding
C: 115 µm to 135 µm
adhesive
D: contact 135 µm to 250 µm
NOTE 1 Data above assumes a 125 µm
cladding diameter.

4.2 Calibration procedure
On commissioning, and periodically during its life, the microscope system shall be calibrated.
Fix the artefact(s) on the microscope system, focus the image.
Follow manufacturer’s instructions on how to calibrate the system using the artefact. Generally,
this should entail viewing the artefact and verifying that the small features and contrast targets
are “reliably detectable”; and that the region of interest can be fully viewed or scanned.
“Reliably detectable” is defined as sufficiently clear and visible so that a typical technician of
average training would recognize the feature at least 98 % of the time.
For automated systems, software utilities to perform this calibration shall be provided. In any
event, those systems shall be able to perform the same calibration to validate that they can
reliably detect the features of the artefact.

---------------------- Page: 9 ----------------------
– 8 – 61300-3-44  IEC:2012
4.3 Inspection procedure
Focus the microscope so that a crisp image can be seen.
Locate all defects and scratches within the zones prescribed in the acceptance criteria. Count
and measure defects and count scratches within each zone. Scratches that are extremely wide
may be judged to be too large per the acceptance criteria and result in immediate failure of the
DUT.
Once all defects and scratches have been quantified, the results should be totalled by zone
and compared to the appropriate acceptance criteria. Such criteria can be found in 5.4.
Any endface with quantified defects or scratches in excess of the values shown in any given
zone on the table are determined to have failed.
If the fibre fails inspection for defects, the user shall clean the fibre and repeat the inspection
process. In this way, loose debris can be removed and the fibre may be able to pass a
subsequent inspection without rework or scrap. Cleaning shall be repeated a number of times
consistent with the cleaning procedure being used.
Figure 1 shows the inspection procedure flow.

---------------------- Page: 10 ----------------------
61300-3-44  IEC:2012 – 9 –

Begin

Quantify
scratches and

defects


Meets

No
Acceptance

Criteria?

Fail for
No

Fail for
Scratches?
defects
Yes

Clean fiber
Yes
endface

Quantify

scratches and
defects


No Yes
Decrease

defects?

DUT passes DUT fails


End
IEC  1364/12

Figure 1 – Inspection procedure flow

---------------------- Page: 11 ----------------------
– 10 – 61300-3-44  IEC:2012
4.4 Visual Requirements
Visual requirements are shown in Table 2.
Table 2 – Visual requirements for fibre receptacle
interface equipped with transceivers
Zone name
Scratches Defects
(diameter)
A: core
2 ≤ 3 µm
None
0µm to 15 µm
None > 3 µm
No limit ≤ 5µm
B: cladding No limit ≤ 3 µm
3 from 5µm to 10 µm
15µm to 115 µm
3 > 3 µm
None > 10 µm
C: adhesive
No limit No limit
115µm to 135 µm
No limit ≤ 20µm
D: contact
No limit
3 from 20µm to 30µm
135µm to 250 µm
None > 30 µm
NOTE 1 For scratches, the requirement refers to width.
NOTE 2 No visible subsurface cracks are allowed in the core or cladding zones.
NOTE 3 All loose particles must be removed. If defect(s) are non-removable, it must be within the criteria
above to be acceptable for use.
NOTE 4 There are no requirements for the area outside the contact zone since defects in this area have no
influence on the performance. Cleaning loose debris beyond this region is recommended good practice.
NOTE 5 Criteria should be applied to all fibre pairs in the array for functionality of any fibre pairs in the array.
NOTE 6 Structural features that are part of the functional design of the optical fibre, such as microstructures,
are not considered defects.

---------------------- Page: 12 ----------------------
61300-3-44  IEC:2012 – 11 –
Annex A
(normative)

Diagram of calibration artefact and method of manufacture

A.1 High resolution artefact
The artefact is constructed by inducing a series of scratches into an otherwise pristine endface
(see Figure A.2). The scratches should be cut into a simple, but recognizable pattern to ensure
the user can differentiate them from scratches that may be created through normal use and
cleaning during the artefact’s life. This is done using a device commonly referred to as a “nano-
indenter”. There are several manufacturers throughout the world that can supply such a device.
A nano-indenter is similar to a hardness tester, but uses much smaller indentation tips with
less force (see Figure A.1). The operating principle of a nano-indenter is quite simple. A tip is
brought into contact with the sample, a small force is applied and the tip compresses the
sample and indents itself into the material. Based on the depth to which the tip indents, one
can determine the hardness of the sample.
To create the high resolution artefact, the device is used in a slightly different manner. The
sample is a pristine fibre end face. For practical purposes, a common 1,25 mm or 2,5 mm
ferrule with a fibre polished finish is recommended. The tip shall be a 90° cone type with
1,0 µm radius. The tip is brought into contact with the cladding and a force of 450 µN is applied.
This will allow the tip to indent approximately 20 nm into the surface of the cladding. Then the
tip is translated across the surface of the cladding so that it scratches the glass. The result will
be a scratch that is approximately 20 nm deep and 400 nm to 700 nm wide. Of key importance
is that the scratch is created with a means that does not produce a sharp edge, and is
therefore, low contrast. Many other means will, unless mitigated, produce a “trench” type of
scratch that will be high contrast. This is the purpose of the radius shaped tip.
Each artefact shall be measured using a method traceable to a national standards body. Two
suitable means are by scanning electron microscope or atomic force microscope. The width of
the scratch shall be within 400 nm to 700 nm and the depth of the scratch shall be within 15 nm
to 40 nm. The edges of the scratch cannot be quantitatively measured, but they should be
viewed with a high resolution microscope to ensure the scratch is very low in contrast.

IEC  1365/12
Figure A.1 – Example of nano-indentation test system

---------------------- Page: 13 ----------------------
– 12 – 61300-3-44  IEC:2012





IEC  1366/12
Figure A.2 – Example of high resolution artefact:
Sample of pattern cut into a 125 µm cladding on the end of a polished SC connector

---------------------- Page: 14 ----------------------
m
u
0
5
61300-3-44  IEC:2012 – 13 –
A.2 Low resolution artefact
This artefact can be constructed as either deposited chrome on glass, or by some other means.
The contrast level for this is less critical. Recommended construction is as follows (see Figure
A.3):
– flat glass substrate with deposited chrome (<15% transmittance);
– five detection targets (solid circles) near the center arranged in a star pattern as shown
below;
– each target measuring 2,0 µm in diameter;
– the outer 4 targets shall be 50 µm apart from one another;
– a large field-of-view circle measuring 250 µm in diameter and 5 µm in line width (unfilled
circle);
– field of view circle labelled with “FOV 250 um”.


IEC  1367/12
Figure A.3 – Example of low resolution artefact pattern

2

V
O
F

---------------------- Page: 15 ----------------------
– 14 – 61300-3-44  IEC:2012
Bibliography
IEC 61300-1, Fibre optic interconnecting devices and passive components – Basic test and
measurement procedures – Part 1: General and guidance
IEC 61300-3-35, Fibre optic interconnecting devices and passive components – Basic test and
measurement procedures
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.