IEC 60115-8:2023

IEC 60115-8
®

Edition 3.0 2023-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside


Fixed resistors for use in electronic equipment –
Part 8: Sectional specification: Fixed surface mount resistors

Résistances fixes utilisées dans les équipements électroniques –
Partie 8: Spécification intermédiaire: Résistances fixes pour montage en surface
IEC 60115-8:2023-08(en-fr)

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IEC 60115-8

®


Edition 3.0 2023-08




INTERNATIONAL



STANDARD




NORME


INTERNATIONALE
colour

inside










Fixed resistors for use in electronic equipment –

Part 8: Sectional specification: Fixed surface mount resistors



Résistances fixes utilisées dans les équipements électroniques –

Partie 8: Spécification intermédiaire: Résistances fixes pour montage en surface















INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE





ICS 31.040.10  ISBN 978-2-8322-7437-8




Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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– 2 – IEC 60115-8:2023 © IEC 2023
CONTENTS
FOREWORD . 8
1 Scope . 11
2 Normative references . 11
3 Terms, definitions, product technologies and product classification . 12
3.1 Terms and definitions . 12
3.2 Product technologies . 12
3.3 Product classification . 13
4 Preferred characteristics . 13
4.1 General . 13
4.2 Style and dimensions . 13
4.2.1 Preferred styles and outline dimensions for rectangular (RR) resistors . 13
4.2.2 Preferred styles and outline dimensions for transverse (RT) resistors . 14
4.2.3 Preferred styles and outline dimensions for cylindrical (RC) resistors . 15
4.2.4 Preferred styles and outline dimensions for wire-wound (RW) resistors . 16
4.3 Preferred climatic categories . 17
4.4 Resistance . 17
4.5 Tolerances on resistance . 17
4.6 Rated dissipation P . 17
70
4.7 Limiting element voltage U . 18
max
4.8 Insulation voltage U . 18
ins
4.9 Insulation resistance R . 18
ins
5 Tests and test severities . 18
5.1 General provisions for tests invoked by this document . 18
5.2 Preparation of specimens . 19
5.2.1 Drying . 19
5.2.2 Mounting of components on test boards . 19
5.3 Tests . 25
5.3.1 Resistance . 25
5.3.2 Temperature coefficient of resistance . 25
5.3.3 Temperature rise . 26
5.3.4 Endurance at the rated temperature 70 °C . 26
5.3.5 Endurance at a maximum temperature: UCT . 26
5.3.6 Short-term overload . 27
5.3.7 Single-pulse high-voltage overload test . 27
5.3.8 Periodic-pulse high-voltage overload test . 28
5.3.9 Electrostatic discharge (ESD) test . 29
5.3.10 Visual examination . 29
5.3.11 Gauging of dimensions . 29
5.3.12 Detail dimensions . 30
5.3.13 Shear (adhesion) test . 30
5.3.14 Substrate bending test . 30
5.3.15 Shock . 31
5.3.16 Vibration . 31
5.3.17 Rapid change of temperature . 31
5.3.18 Rapid change of temperature, ≥ 100 cycles . 31
5.3.19 Climatic sequence . 31

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IEC 60115-8:2023 © IEC 2023 – 3 –
5.3.20 Damp heat, steady state . 32
5.3.21 Solderability, with lead-free solder . 33
5.3.22 Solderability, with SnPb solder . 33
5.3.23 Resistance to soldering heat . 34
5.3.24 Solvent resistance . 34
5.3.25 Insulation resistance . 34
5.3.26 Voltage proof . 34
5.3.27 Flammability test . 35
5.4 Optional and/or additional tests . 35
5.4.1 Single-pulse high-voltage overload test . 35
5.4.2 Periodic-pulse overload test . 35
5.4.3 Operation at low temperature. 36
5.4.4 Damp heat, steady state, accelerated . 36
6 Performance requirements. 37
6.1 General . 37
6.2 Limits for change of resistance at tests . 37
6.3 Temperature coefficient of resistance . 40
6.4 Temperature rise . 40
6.5 Visual examination . 41
6.5.1 General visual criteria . 41
6.5.2 Visual criteria after tests . 41
6.5.3 Visual criteria for the packaging . 41
6.6 Solderability . 41
6.7 Insulation resistance . 42
6.8 Flammability . 42
7 Marking, packaging and ordering information . 42
7.1 Marking of the component . 42
7.2 Packaging . 42
7.3 Marking of the packaging . 42
7.4 Ordering information . 42
8 Detail specifications . 43
8.1 General . 43
8.2 Information to be specified in a detail specification . 43
8.2.1 Outline drawing or illustration . 43
8.2.2 Style and dimensions . 43
8.2.3 Climatic category . 43
8.2.4 Resistance range . 44
8.2.5 Tolerances on resistance . 44
8.2.6 Rated dissipation P . 44
70
8.2.7 Limiting element voltage U . 44
max
8.2.8 Insulation voltage U . 44
ins
8.2.9 Insulation resistance R . 44
ins
8.2.10 Test severities . 44
8.2.11 Limits of resistance change after testing . 44
8.2.12 Temperature coefficient of resistance . 44
8.2.13 Marking . 45
8.2.14 Ordering information . 45
8.2.15 Mounting . 45

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– 4 – IEC 60115-8:2023 © IEC 2023
8.2.16 Storage. 45
8.2.17 Transportation . 45
8.2.18 Additional information . 45
8.2.19 Quality assessment procedures . 45
8.2.20 0 Ω Resistors . 45
9 Quality assessment procedures . 45
9.1 General . 45
9.2 Definitions. 46
9.2.1 Primary stage of manufacture . 46
9.2.2 Structurally similar components . 46
9.2.3 Assessment level EZ . 46
9.3 Formation of inspection lots . 46
9.4 Approved component (IECQ AC) procedures . 47
9.5 Qualification approval (QA) procedures . 47
9.5.1 General . 47
9.5.2 Qualification approval . 47
9.5.3 Quality conformance inspection . 48
9.6 Capability certification (IECQ AC-C) procedures . 48
9.7 Technology certification (IECQ-AC-TC) procedures . 48
9.8 Periodical evaluation of termination plating . 48
9.9 Delayed delivery . 48
9.10 Certified test records. 48
9.11 Certificate of conformity (CoC) . 48
Annex A (normative) Symbols and abbreviated terms . 60
A.1 Symbols . 60
A.2 Abbreviated terms . 62
Annex B (normative) Visual examination criteria . 63
B.1 General . 63
B.2 Criteria for general visual examination of body of specimens . 63
B.3 Criteria for general visual examination of electrode of specimen . 64
B.4 Criteria for general visual examination of marking of specimen . 64
B.5 Criteria for packaging . 65
Annex C (informative) Workmanship requirements for the assembly of SMD resistors . 66
C.1 General . 66
C.2 Out of alignment from solder pad . 66
C.3 Formation of fillet . 67
C.3.1 Function of the fillet . 67
C.3.2 Rectangular (RR) and transverse (RT) resistors . 67
C.3.3 Cylindrical (RC) resistors . 68
C.4 Thickness of solder paste between the pad and electrode . 69
C.5 Solder ball . 70
Annex D (normative) 0 Ω resistors (jumpers). 71
D.1 General . 71
D.2 Preferred characteristics . 71
D.3 Tests and test severities . 71
D.4 Performance requirements . 72
D.5 Marking, packaging and ordering information . 73
D.6 Detail specification . 73

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IEC 60115-8:2023 © IEC 2023 – 5 –
D.7 Quality assessment procedures . 73
Annex E (informative) Guidance on the application of optional and/or additional tests . 74
E.1 General . 74
E.2 Single-pulse high-voltage overload test . 74
E.3 Periodic-pulse overload test . 75
E.4 Operation at low temperature . 75
E.5 Damp heat, steady state, accelerated . 76
Annex F (informative) Temperature rise of recommended test boards in the endurance
test at the rated temperature 70 °C . 78
F.1 General . 78
F.2 Position of the indicated resistor temperature in the endurance test at the
rated temperature 70 °C. 78
F.2.1 Simulation model . 78
F.2.2 Simulation result . 81
F.2.3 Position suitable for determining the resistor temperature at endurance
at the rated temperature 70 °C . 82
F.3 Applied power of each recommended test board and temperature rise at
endurance test at the rated temperature 70 °C . 82
F.3.1 Precautions . 82
F.3.2 Data of temperature rise for RR resistors (simulation) . 83
F.3.3 Data of temperature rise for RT resistors (simulation) . 87
F.3.4 Data of temperature rise for RC resistors (Simulation) . 90
F.4 Ideal number of specimens to mount on each test board . 91
F.4.1 General . 91
F.4.2 Variation of temperature within the test board . 91
Annex G (informative) Reason for selecting test boards with extremely wide patterns
for high rated dissipation resistors . 94
G.1 General . 94
G.2 Simulation example of recommended test board for RT3263M made to be

equivalent to the usage condition . 94
G.3 Temperature rise when there is no efficient cooling system . 96
G.4 Dimensions of recommended test board when further raise of rated
dissipation is required . 97
Annex X (informative) Cross-references to the prior edition of this document . 100
Bibliography . 103

Figure 1 – Shape and dimension of rectangular (RR) resistors . 13
Figure 2 – Shape and dimension of transverse (RT) resistors . 14
Figure 3 – Shape and dimension of cylindrical (RC) resistors . 15
Figure 4 – Shape and dimension of wire-wound (RW) resistors . 16
Figure 5 – Derating curve based on ambient temperature . 18
Figure 6 – Basic appearance of recommended test board . 20
Figure 7 – Basic layout for mechanical, environmental and electrical tests, Kelvin (4
point) connections. 21
Figure 8 – Attachment of the sense line for Kelvin (4-point) connections for specimens

with nominal resistance lower than 100 mΩ . 21
Figure 9 – Basic layout for mechanical, environmental and electrical tests . 25
Figure F.1 – Simulation model . 80
Figure F.2 – Simulation result . 82

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– 6 – IEC 60115-8:2023 © IEC 2023
Figure F.3 – Load reduction curve with terminal part temperature as x-axis . 83
Figure F.4 – RR0402M relationship between power and temperature at 70 °C . 84
Figure F.5 – RR0603M relationship between power and temperature at 70 °C . 84
Figure F.6 – RR1005M relationship between power and temperature at 70 °C . 84
Figure F.7 – RR1608M relationship between power and temperature at 70 °C . 85
Figure F.8 – RR2012M relationship between power and temperature at 70 °C . 85
Figure F.9 – RR3216M relationship between power and temperature at 70 °C . 85
Figure F.10 – RR3225M relationship between power and temperature at 70 °C . 86
Figure F.11 – RR4532M relationship between power and temperature at 70 °C . 86
Figure F.12 – RR5025M relationship between power and temperature at 70 °C . 86
Figure F.13 – RR6332M relationship between power and temperature at 70 °C . 87
Figure F.14 – RT0510M relationship between power and temperature at 70 °C . 87
Figure F.15 – RT0816M relationship between power and temperature at 70 °C . 88
Figure F.16 – RT1220M relationship between power and temperature at 70 °C .
...