SIST EN IEC 62680-1-2:2019

SLOVENSKI STANDARD
SIST EN IEC 62680-1-2:2019
01-februar-2019
1DGRPHãþD
SIST EN 62680-1-2:2018
Vmesniki univerzalnega serijskega vodila za prenos podatkov in napajanje - 1-2.
del: Skupne komponente - Specifikacija zagotavljanja napajanja prek USB (IEC
62680-1-2:2018)
Universal Serial Bus interfaces for data and power - Part 1-2: Common components -
USB Power Delivery Specification (IEC 62680-1-2:2018)
Schnittstellen des Universellen Seriellen Busses für Daten und Energie – Teil 1-2:
Gemeinsame Komponenten – Festlegung für die USB-Stromversorgung (IEC 62680-1-
2:2018)
Interfaces bus série universel (USB) pour les données et l'alimentation électrique - Partie
1-2: Composants communs - Spécification USB pour la fourniture de courant (IEC 62680
-1-2:2018)
Ta slovenski standard je istoveten z: EN IEC 62680-1-2:2018
ICS:
35.200 Vmesniška in povezovalna Interface and interconnection
oprema equipment
SIST EN IEC 62680-1-2:2019 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 62680-1-2:2019

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SIST EN IEC 62680-1-2:2019


EUROPEAN STANDARD EN IEC 62680-1-2

NORME EUROPÉENNE

EUROPÄISCHE NORM
June 2018
ICS 29.220, 33.120, 35.200 Supersedes EN 62680-1-2:2017
English Version
Universal Serial Bus interfaces for data and power - Part 1-2:
Common components - USB Power Delivery Specification
(IEC 62680-1-2:2018)
Interfaces bus série universel (USB) pour les données et Schnittstellen des Universellen Seriellen Busses für Daten
l'alimentation électrique - Partie 1-2: Composants communs und Energie - Teil 1-2: Gemeinsame Komponenten -
- Spécification USB pour la fourniture de courant Festlegung für die USB-Stromversorgung
(IEC 62680-1-2:2018) (IEC 62680-1-2:2018)
This European Standard was approved by CENELEC on 2018-05-17. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.



European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 62680-1-2:2018 E

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SIST EN IEC 62680-1-2:2019
EN IEC 62680-1-2:2018 (E)


European foreword
The text of document 100/2968/CDV, future edition 3 of IEC 62680-1-2, prepared by technical area
14: "Interfaces and methods of measurement for personal computing equipment", of IEC/TC 100:
"Audio, video and multimedia systems and equipment" was submitted to the IEC-CENELEC parallel
vote and approved by CENELEC as EN IEC 62680-1-2:2018.

The following dates are fixed:
(dop) 2019-02-17
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2021-05-17
standards conflicting with the
document have to be withdrawn

This document supersedes EN 62680-1-2:2017.

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 62680-1-2:2018 was approved by CENELEC as a
European Standard without any modification.
2

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SIST EN IEC 62680-1-2:2019




IEC 62680-1-2

®


Edition 3.0 2018-04




INTERNATIONAL



STANDARD








colour

inside










Universal serial bus interfaces for data and power –

Part 1-2: Common components – USB Power Delivery specification



























INTERNATIONAL

ELECTROTECHNICAL


COMMISSION





ICS 29.220; 33.120; 35.200 ISBN 978-2-8322-5581-0



  Warning! Make sure that you obtained this publication from an authorized distributor.


® Registered trademark of the International Electrotechnical Commission

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SIST EN IEC 62680-1-2:2019
– 2 – IEC 62680-1-2:2018 © IEC 2018
© USB-IF:2017
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

UNIVERSAL SERIAL BUS INTERFACES FOR DATA AND POWER –

Part 1-2: Common components – USB Power Delivery specification

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national
electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all
questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities,
IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS)
and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC
National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental
and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with
the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between
the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus
of opinion on the relevant subjects since each technical committee has representation from all interested IEC National
Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in
that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC
cannot be held responsible for the way in which they are used or for any misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to
the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and
the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment
services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by
independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its
technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature
whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of,
or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable
for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights.
IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62680-1-2 has been prepared by technical area 14: Interfaces and methods
of measurement for personal computing equipment, of IEC technical committee 100: Audio, video and
multimedia systems and equipment.
This third edition cancels and replaces the second edition published in 2017 and constitutes a technical
revision.
The text of this standard was prepared by the USB Implementers Forum (USB-IF). The structure and
editorial rules used in this publication reflect the practice of the organization which submitted it.

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SIST EN IEC 62680-1-2:2019
IEC 62680-1-2:2018 © IEC 2018 – 3 –
© USB-IF:2017
The text of this International Standard is based on the following documents:
CDV Report on voting
100/2968/CDV 100/3045/RVC

Full information on the voting for the approval of this International Standard can be found in the report
on voting indicated in the above table.
The committee has decided that the contents of this document will remain unchanged until the stability
date indicated on the IEC website under "http://webstore.iec.ch" in the data related to the specific
document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates that it
contains colours which are considered to be useful for the correct understanding of its
contents. Users should therefore print this document using a colour printer.

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© USB-IF:2017
INTRODUCTION
The IEC 62680 series is based on a series of specifications that were originally developed by the USB
Implementers Forum (USB-IF). These specifications were submitted to the IEC under the auspices of a
special agreement between the IEC and the USB-IF.
This standard is the USB-IF publication USB Power Delivery Specification Revision 3.0 V.1.1 and ECNs
through 12 June 2017.
The USB Implementers Forum, Inc.(USB-IF) is a non-profit corporation founded by the group of
companies that developed the Universal Serial Bus specification. The USB-IF was formed to provide a
support organization and forum for the advancement and adoption of Universal Serial Bus technology.
The Forum facilitates the development of high-quality compatible USB peripherals (devices), and
promotes the benefits of USB and the quality of products that have passed compliance testing.
ANY USB SPECIFICATIONS ARE PROVIDED TO YOU "AS IS, "WITH NO WARRANTIES
WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, OR
FITNESS FOR ANY PARTICULAR PURPOSE. THE USB IMPLEMENTERS FORUM AND THE
AUTHORS OF ANY USB SPECIFICATIONS DISCLAIM ALL LIABILITY, INCLUDING LIABILITY FOR
INFRINGEMENT OF ANY PROPRIETARY RIGHTS, RELATING TO USE OR IMPLEMENTATION OR
INFORMATION IN THIS SPECIFICAITON.
THE PROVISION OF ANY USB SPECIFICATIONS TO YOU DOES NOT PROVIDE YOU WITH ANY
LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL
PROPERTY RIGHTS.
Entering into USB Adopters Agreements may, however, allow a signing company to participate in a
reciprocal, RAND-Z licensing arrangement for compliant products. For more information, please see:
http://www.usb.org/developers/docs/
http://www.usb.org/developers/devclass_docs#approved
IEC DOES NOT TAKE ANY POSITION AS TO WHETHER IT IS ADVISABLE FOR YOU TO ENTER INTO
ANY USB ADOPTERS AGREEMENTS OR TO PARTICIPATE IN THE USB IMPLEMENTERS FORUM.”

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IEC 62680-1-2:2018 © IEC 2018 – 5 –
© USB-IF:2017





Universal Serial Bus
Power Delivery Specification







Revision:  3.0
Version:  1.1+ ECNs through 12 June 2017
Release date: 12 January 2017

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© USB-IF:2017
Editors
Bob Dunstan Renesas Electronics Corp.
Richard Petrie DisplayLink
Contributors
Charles Wang ACON, Advanced-Connectek, Inc.
Conrad Choy ACON, Advanced-Connectek, Inc.
Steve Sedio ACON, Advanced-Connectek, Inc.
Vicky Chuang ACON, Advanced-Connectek, Inc.

Joseph Scanlon Advanced Micro Devices

Caspar Lin Allion Labs, Inc.

Casper Lee Allion Labs, Inc.

Howard Chang Allion Labs, Inc.
Greg Stewart Analogix Semiconductor, Inc.

Mehran Badii Analogix Semiconductor, Inc.

Bill Cornelius Apple

Colin Whitby-Strevens Apple

Corey Axelowitz Apple
Corey Lange Apple
Dave Conroy Apple
David Sekowski Apple

Girault Jones Apple

James Orr Apple
Jason Chung Apple

Jennifer Tsai Apple

Karl Bowers Apple

Keith Porthouse Apple

Matt Mora Apple
Paul Baker Apple

Reese Schreiber Apple

Sameer Kelkar Apple

Sasha Tietz Apple

Scott Jackson Apple
Sree Raman Apple

William Ferry Apple

Zaki Moussaoui Apple
Bernard Shyu Bizlink Technology, Inc.
Eric Wu Bizlink Technology, Inc.
Morphy Hsieh Bizlink Technology, Inc.

Shawn Meng Bizlink Technology Inc.
Tiffany Hsiao Bizlink Technology, Inc.
Weichung Ooi Bizlink Technology, Inc.
Michal Staworko Cadence Design Systems, Inc.

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IEC 62680-1-2:2018 © IEC 2018 – 7 –
© USB-IF:2017

Alessandro Ingrassia Canova Tech

Andrea Colognese Canova Tech

Davide Ghedin Canova Tech

Matteo Casalin Canova Tech

Nicola Scantamburlo Canova Tech
Yi-Feng Lin Canyon Semiconductor
YuHung Lin Canyon Semiconductor

Anup Nayak Cypress Semiconductor
Jagadeesan Raj Cypress Semiconductor
Pradeep Bajpai Cypress Semiconductor


Rushil Kadakia Cypress Semiconductor

Steven Wong Cypress Semiconductor

Subu Sankaran Cypress Semiconductor
Sumeet Gupta Cypress Semiconductor
Venkat Mandagulathar Cypress Semiconductor


Adolfo Montero Dell Inc.

Bruce Montag Dell Inc.

Gary Verdun Dell Inc.

Merle Wood Dell Inc.

Mohammed Hijazi Dell Inc.

Siddhartha Reddy Dell Inc.

Dan Ellis DisplayLink

Jason Young DisplayLink

Kevin Jacobs DisplayLink

Peter Burgers DisplayLink
PD Chair/Device Policy Lead
Richard Petrie DisplayLink
Abel Astley Ellisys

Chuck Trefts Ellisys

Emmanuel Durin Ellisys

Mario Pasquali Ellisys

Tim Wei Ellisys

Chien-Cheng Kuo Etron Technology, Inc.

Jack Yang Etron Technology, Inc.

Richard Crisp Etron Technology, Inc.

Shyanjia Chen Etron Technology, Inc.

TsungTa Lu Etron Technology, Inc.

Christian Klein Fairchild Semiconductor

Oscar Freitas Fairchild Semiconductor
Souhib Harb Fairchild Semiconductor

AJ Yang Foxconn / Hon Hai
Fred Fons Foxconn / Hon Hai

Steve Sedio Foxconn / Hon Hai

Terry Little Foxconn / Hon Hai
Bob McVay Fresco Logic Inc.
Christopher Meyers Fresco Logic Inc.

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© USB-IF:2017
Tom Burton Fresco Logic Inc.

Dian Kurniawan Fresco Logic Inc.

Adam Rodriguez Google Inc.

Alec Berg Google Inc.

David Schneider Google Inc.

Jim Guerin Google Inc.

Juan Fantin Google Inc.

Ken Wu Google Inc.

Mark Hayter Google Inc.
Nithya Jagannathan Google Inc.


Todd Broch Google Inc.

Vincent Palatin Google Inc.

Mike Engbretson Granite River Labs

Rajaraman V Granite River Labs

Alan Berkema Hewlett Packard

Lee Atkinson Hewlett Packard

Rahul Lakdawala Hewlett Packard

Robin Castell Hewlett Packard

Roger Benson Hewlett Packard

Ron Schooley Hewlett Packard

Suketu Partiwala Hewlett Packard

Vaibhav Malik Hewlett Packard

Walter Fry Hewlett Packard
PD Chair/Protocol WG Lead
Bob Dunstan Intel Corporation

Brad Saunders Intel Corporation

Chee Lim Nge Intel Corporation

Christine Krause Intel Corporation

Dan Froelich Intel Corporation

David Harriman Intel Corporation

David Hines Intel Corporation
David Thompson Intel Corporation

Guobin Liu Intel Corporation

Harry Skinner Intel Corporation

Henrik Leegaard Intel Corporation

Jervis Lin Intel Corporation

John Howard Intel Corporation

Karthi Vadivelu Intel Corporation

Leo Heiland Intel Corporation

Maarit Harkonen Intel Corporation

Nge Chee Lim Intel Corporation

Paul Durley Intel Corporation
System Policy Lead
Rahman Ismail Intel Corporation

Ronald Swartz Intel Corporation

Sarah Sharp Intel Corporation

Scott Brenden Intel Corporation

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IEC 62680-1-2:2018 © IEC 2018 – 9 –
© USB-IF:2017

Sridharan Ranganathan Intel Corporation

Steve McGowan Intel Corporation
PD Chair/Compliance Lead
Tim McKee Intel Corporation

Toby Opferman Intel Corporation

Jia Wei Intersil Corporation

Kenta Minejima Japan Aviation Electronics Industry Ltd. (JAE)

Mark Saubert Japan Aviation Electronics Industry Ltd. (JAE)

Toshio Shimoyama Japan Aviation Electronics Industry Ltd. (JAE)
Brian Fetz Keysight Technologies Inc.
Babu Mailachalam Lattice Semiconductor Corp


Gianluca Mariani Lattice Semiconductor Corp
Joel Coplen Lattice Semiconductor Corp

Thomas Watza Lattice Semiconductor Corp

Vesa Lauri Lattice Semiconductor Corp

Daniel H Jacobs LeCroy Corporation

Jake Jacobs LeCroy Corporation

Kimberley McKay LeCroy Corporation

Mike Micheletti LeCroy Corporation

Roy Chestnut LeCroy Corporation

Tyler Joe LeCroy Corporation
Phil Jakes Lenovo

Dave Thompson LSI Corporation

Alan Kinningham Luxshare-ICT

Daniel Chen Luxshare-ICT

Josue Castillo Luxshare-ICT

Scott Shuey Luxshare-ICT

Chris Yokum MCCI Corporation

Geert Knapen MCCI Corporation
Terry Moore MCCI Corporation

Velmurugan Selvaraj MCCI Corporation

Brian Marley Microchip Technology Inc.

Dave Perchlik Microchip Technology Inc.

Don Perkins Microchip Technology Inc.

John Sisto Microchip Technology Inc.

Josh Averyt Microchip Technology Inc.

Kiet Tran Microchip Technology Inc.

Mark Bohm Microchip Technology Inc.

Matthew Kalibat Microchip Technology Inc.

Mick Davis Microchip Technology Inc.

Rich Wahler Microchip Technology Inc.
Ronald Kunin Microchip Technology Inc.

Shannon Cash Microchip Technology Inc.
Anthony Chen Microsoft Corporation
Dave Perchlik Microsoft Corporation

David Voth Microsoft Corporation

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© USB-IF:2017
Geoff Shew Microsoft Corporation

Jayson Kastens Microsoft Corporation

Kai Inha Microsoft Corporation

Marwan Kadado Microsoft Corporation

Michelle Bergeron Microsoft Corporation
Rahul Ramadas Microsoft Corporation

Randy Aull Microsoft Corporation

Shiu Ng Microsoft Corporation
Timo Toivola Microsoft Corporation

Toby Nixon Microsoft Corporation

Vivek Gupta Microsoft Corporation

Yang You Microsoft Corporation

Dan Wagner Motorola Mobility Inc.

Ben Crowe MQP Electronics Ltd.

Pat Crowe MQP Electronics Ltd.

Sten Carlsen MQP Electronics Ltd.

Frank Borngräber Nokia Corporation

Kai Inha Nokia Corporation

Pekka Leinonen Nokia Corporation
PD Vice-Chair/Device Policy Lead
Richard Petrie Nokia Corporation
Physical Layer WG Lead
Sten Carlsen Nokia Corporation

Abhijeet Kulkarni NXP Semiconductors

Ahmad Yazdi NXP Semiconductors

Bart Vertenten NXP Semiconductors

Dong Nguyen NXP Semiconductors

Guru Prasad NXP Semiconductors

Ken Jaramillo NXP Semiconductors

Krishnan TN NXP Semiconductors
Michael Joehren NXP Semiconductors

Robert de Nie NXP Semiconductors

Rod Whitby NXP Semiconductors

Vijendra Kuroodi NXP Semiconductors

Robert Heaton Obsidian Technology

Bryan McCoy ON Semiconductor

Christian Klein ON Semiconductor

Cor Voorwinden ON Semiconductor
Power Supply WG Lead
Edward Berrios ON Semiconductor

Oscar Freitas ON Semiconductor

Tom Duffy ON Semiconductor

Craig Wiley Parade Technologies Inc.

Aditya Kulkarni Power Integrations

Rahul Joshi Power Integrations

Ricardo Pregiteer Power Integrations

Chris Sporck Qualcomm, Inc.

Craig Aiken Qualcomm, Inc.

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© USB-IF:2017
George Paparrizos Qualcomm, Inc
Giovanni Garcea Qualcomm, Inc
James Goel Qualcomm, Inc
Joshua Warner Qualcomm, Inc

Narendra Mehta Qualcomm, Inc.

Terry Remple Qualcomm, Inc.

Will Kun Qualcomm, Inc.

Yoram Rimoni Qualcomm, Inc.

Atsushi Mitamura Renesas Electronics Corp.

Bob Dunstan Renesas Electronics Corp.

Dan Aoki Renesas Electronics Corp.

Kiichi Muto Renesas Electronics Corp.

Masami Katagiri Renesas Electronics Corp.

Nobuo Furuya Renesas Electronics Corp.

Patrick Yu Renesas Electronics Corp.

Peter Teng Renesas Electronics Corp.

Philip Leung Renesas Electronics Corp.

Steve Roux Renesas Electronics Corp.

Tetsu Sato Renesas Electronics Corp.

Toshifumi Yamaoka Renesas Electronics Corp.
Chunan Kuo Richtek Technology Corporation
Heinz Wei Richtek Technology Corporation

Tatsuya Irisawa Ricoh Company Ltd.

Akihiro Ono Rohm Co. Ltd.

Chris Lin Rohm Co. Ltd.

Hidenori Nishimoto Rohm Co. Ltd.

Kris Bahar Rohm Co. Ltd.

Manabu Miyata Rohm Co. Ltd.

Ruben Balbuena Rohm Co. Ltd.

Takashi Sato Rohm Co. Ltd.

Vijendra Kuroodi Rohm Co. Ltd.

Yusuke Kondo Rohm Co. Ltd.

Matti Kulmala Salcomp Plc

Toni Lehimo Salcomp Plc

Tong Kim Samsung Electronics Co. Ltd.
Cab Con WG Lead
Alvin Cox Seagate Technology LLC

John Hein Seagate Technology LLC

Marc Noblitt Seagate Technology LLC

Ronald Rueckert Seagate Technology LLC

Tony Priborsky Seagate Technology LLC

Chin Chang Semtech Corporation

Kafai Leung Silicon Laboratories, Inc.

Abhishek Sardeshpande SiliConch Systems Private Limited

Jaswanth Ammineni SiliConch Systems Private Limited

Kaustubh Kumar SiliConch Systems Private Limited

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Pavitra Balasubramanian SiliConch Systems Private Limited

Rakesh Polasa SiliConch Systems Private Limited

Vishnu Pusuluri SiliConch Systems Private Limited

John Sisto SMSC

Ken Gay SMSC

Mark Bohm SMSC

Richard Wahler SMSC

Shannon Cash SMSC

Tim Knowlton SMSC

William Chiechi SMSC

Bob Dunstan Specwerkz

Fabien Friess ST-Ericsson

Giuseppe Platania ST-Ericsson

Jean-Francois Gatto ST-Ericsson

Milan Stamenkovic ST-Ericsson

Nicolas Florenchie ST-Ericsson

Patrizia Milazzo ST-Ericsson

Christophe Lorin ST-Microelectronics

John Bloomfield ST-Microelectronics

Massimo Panzica ST-Microelectronics

Meriem Mersel ST-Microelectronics

Nathalie Ballot ST-Microelectronics

Pascal Legrand ST-Microelectronics

Patrizia Milazzo ST-Microelectronics

Richard O’Connor ST-Microelectronics
Zongyao Wen Synopsys, Inc.

Joan Marrinan Tektronix

Kimberley McKay Teledyne-LeCroy

Matthew Dunn Teledyne-LeCroy

Tony Minchell Teledyne-LeCroy

Anand Dabak Texas Instruments

Bill Waters Texas Instruments

Bing Lu Texas Instruments
Physical Layer WG Lead
Deric Waters Texas Instruments

Grant Ley Texas Instruments

Ingolf Frank Texas Instruments

Ivo Huber Texas Instruments

Javed Ahmad Texas Instruments

Jean Picard Texas Instruments

Martin Patoka Texas Instruments

Mike Campbell Texas Instruments

Scott Jackson Texas Instruments

Srinath Hosur Texas Instruments

Steven Tom Texas Instruments

Chris Yokum Total Phase

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Brad Cox Ventev Mobile

Colin Vose Ventev Mobile

Dydron Lin VIA Technologies, Inc.

Fong-Jim Wang VIA Technologies, Inc.

Jay Tseng VIA Technologies, Inc.

Rex Chang VIA Technologies, Inc.

Terrance Shih VIA Technologies, Inc.

Jeng Cheng Liu Weltrend Semiconductor

Wayne Lo Weltrend Semiconductor

Charles Neumann Western Digital Technologies, Inc.

Curtis Stevens Western Digital Technologies, Inc.
John Maroney Western Digital Technologies, Inc.

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© USB-IF:2017
Revision History

Revision Version Comments Issue Date
1.0 1.0 Initial release Revision 1.0 5 July, 2012
1.0 1.1 Including errata through 31-October-2012 31 October 2012
1.0 1.2 Including errata through 26-June-2013 26 June, 2013
1.0 1.3 Including errata through 11-March-2014 11 March 2014
2.0 1.0 Initial release Revision 2.0 11 August 2014
2.0 1.1 Including errata through 7-May 2015 7 May 2015
2.0 1.2 Including errata through 25-March-2016 25 March 2016
2.0 1.3 Including errata through 11-January-2017 11 January 2017
3.0 1.0 Initial release Revision 3.0 11 December 2015
3.0 1.0a Including errata through 25-March-2016 25 March 2016
3.0 1.1 Including errata through 12-January-2016 12 January 2017
3.0 1.1+ECNs Markup including ECNs through 12-June-2017: 12 June 2017
• Add VPD Product Type
• Specification Revision Interoperability
• VCONN_Swap Clarification
• Chapter 7 Source and Sink Behavior
• Battery Numbering
• Chunking Clarification
• FR_Swap State Operation
• GoodCRC Specification Revision
• Slew Rate Exception for Source

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© USB-IF:2017

INTELLECTUAL PROPERTY DISCLAIMER
THIS SPECIFICATION IS PROVIDED TO YOU “AS IS” WITH NO WARRANTIES WHATSOEVER,
INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, OR FITNESS FOR
ANY PARTICULAR PURPOSE. THE AUTHORS OF THIS SPECIFICATION DISCLAIM ALL LIABILITY,
INCLUDING LIABILITY FOR INFRINGEMENT OF ANY PROPRIETARY RIGHTS, RELATING TO USE
OR IMPLEMENTATION OF INFORMATION IN THIS SPECIFICATION. THE PROVISION OF THIS
SPECIFICATION TO YOU DOES NOT PROVIDE YOU WITH ANY LICENSE, EXPRESS OR IMPLIED,
BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS.


Please send comments via electronic mail to techsup@usb.org
For industry information, refer to the USB Implementers Forum web page at http://www.usb.org


All product names are trademarks, registered trademarks, or service marks of their respective owners.
Copyright © 2010-2017 Apple Inc, Hewlett-Packard Company, Intel Corporation, Microsoft Corporation,
Renesas, STMicroelectronics, and Texas Instruments
All rights reserved.

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© USB-IF:2017
Table of Contents

FOREWORD . 2
INTRODUCTION . 4
Editors . 6
Contributors . 6
Revision History . 14
INTELLECTUAL PROPERTY DISCLAIMER . 15
Table of Contents . 16
List of Tables . 22
List of Figures . 28
1 Introduction . 36
1.1 Overview . 36
1.2 Purpose . 37
1.3 Scope . 37
1.4 Conventions . 37
1.4.1
...