IEC 62769-8:2023

IEC 62769-8
®

Edition 1.0 2023-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
®
Field device integration (FDI ) –
Part 8: EDD to OPC-UA Mapping

®
Intégration des appareils de terrain (FDI ) –
Partie 8: Mapping de l'EDD avec l'OPC-UA

IEC 62769-8:2023-04(en-fr)

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IEC 62769-8

®


Edition 1.0 2023-04




INTERNATIONAL



STANDARD




NORME


INTERNATIONALE
colour

inside









®
Field device integration (FDI ) –

Part 8: EDD to OPC-UA Mapping


®

Intégration des appareils de terrain (FDI ) –

Partie 8: Mapping de l'EDD avec l'OPC-UA
















INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 33.040.40 ISBN 978-2-8322-6792-9




Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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– 2 – IEC 62769-8:2023 © IEC 2023
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms, definitions, abbreviated terms, acronyms and conventions . 8
3.1 Terms and definitions . 8
3.2 Abbreviated terms and acronyms . 8
3.3 Conventions . 8
3.3.1 Capitalization . 8
3.3.2 Graphical notation . 8
4 Overview . 10
5 Basic principles of explicit mapping . 11
5.1 Semantic maps to tag EDD constructs . 11
5.2 Alias collections . 12
5.2.1 General . 12
5.2.2 Syntax of semantic id for alias mappings . 12
5.3 Namespace Alias Collection . 12
5.4 Reference Type Alias Collection . 14
5.5 Semantic maps for OPC-UA type mapping . 16
5.5.1 General . 16
5.5.2 Syntax of semantic Id for OPC-UA . 16
5.6 Semantic maps for unit mapping . 17
5.6.1 General . 17
5.6.2 Syntax of semantic Id for Units . 17
5.7 Explicit mapping of OPC-UA variable types . 17
5.8 Explicit mapping of complex OPC-UA types . 19
5.9 Explicit mapping of nested object and variable types . 21
5.9.1 General . 21
5.9.2 When to use collections . 21
5.9.3 When to use menus . 21
5.9.4 OPC-UA diagram of nested mapping example . 21
5.9.5 EDD snippet of nested mapping example . 22
5.10 Explicit mapping of methods . 26
5.10.1 Mapping EDD methods to OPC-UA objects, variables or properties . 26
5.10.2 Mapping EDD methods to OPC-UA methods . 26
5.11 Explicit mapping of alarms . 28
5.12 Explicit mapping of units . 35
5.13 Explicit mapping of aggregated data by methods . 36
5.14 Explicit mapping with reference types . 38
5.14.1 General . 38
5.14.2 Example: Adding an additional property to an instance of variable . 39
5.14.3 Example: Adding an additional variable to an instance of a variable or
an object . 40
5.14.4 Example: Adding an OPC-UA alias to a variable . 42
6 Implicit rules . 44
6.1 BrowseName of OPC-UA object . 44
6.1.1 General . 44
6.1.2 Overruling of BrowseName implicit rule . 44

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IEC 62769-8:2023 © IEC 2023 – 3 –
6.2 DisplayName of OPC-UA object . 44
6.2.1 General . 44
6.2.2 Overruling of DisplayName implicit rule . 44
6.3 HANDLING and AccessLevel . 44
6.4 VALIDITY and availability. 44
6.5 Return values of EDD methods . 45
6.5.1 EDD methods mapped to OPC-UA objects, variables, properties or
attributes . 45
6.5.2 EDD methods mapped to OPC-UA methods . 45
6.6 Units . 45
6.7 Range . 45
6.8 Forward cast . 45
6.9 Backward cast . 45
6.10 Abstract OPC-UA types . 45
6.11 Unmapped mandatory OPC-UA properties, components and folders . 46
6.12 Semantic Identifiers and Dictionary References . 46
6.13 Implicit Type Casts for OPC-UA DataTypes . 47
7 Mapping the EDD device model into PA-DIM (OPC 30081) . 48
7.1 General . 48
7.2 Explicit mapping of sub-devices . 48
7.3 Adding sub-devices . 48
Bibliography . 52


Figure 1 – OPC UA Graphical notation for NodeClasses . 8
Figure 2 – OPC UA Graphical notation for References . 9
Figure 3 – OPC UA Graphical notation example . 9
Figure 4 – Optimized Type Reference . 10
Figure 5 – Similarity of OPC-UA objects and EDD collections . 10
Figure 6 – Syntax of sematic ids for EDD entry points . 12
Figure 7 – Syntax of sematic id for alias mapping . 12
Figure 8 – Namespace Collection . 14
Figure 9 – Reference Type Collection . 15
Figure 10 – Use of SEMANTIC_MAP for OPC-UA types . 16
Figure 11 – Syntax of OPC-UA type identifier . 16
Figure 12 – Semantic map example . 16
Figure 13 – Syntax of Unit Identifier . 17
Figure 14 – Most simple mapping example . 17
Figure 15 – EDD variable mapped to an OPC-UA BaseDataVariableType . 18
Figure 16 – Simple mapping example with range and unit . 19
Figure 17 – Mapping of a collection to an OPC-UA variable . 20
Figure 18 – Nested objects and variables . 22
Figure 19 – Example of nested objects and variables . 25
Figure 20 – Simple method . 26
Figure 21 – Example of simple method mapping . 28
Figure 22 – Supported Alarms . 32
Figure 23 – Example of alarm mapping . 35

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Figure 24 – EDD example of explicit unit mapping . 36
Figure 25 – Instance of PADIMType . 37
Figure 26 – Method of type DD_STRING mapped to a string variable . 38
Figure 27 – Adding a property which is not defined in mapped type . 39
Figure 28 – EDD example of adding a property . 40
Figure 29 – Adding a component . 41
Figure 30 – EDD example adding a component . 42
Figure 31 – Adding an alias . 43
Figure 32 – EDD example adding an alias . 43
Figure 33 – Explicit mapping of dictionary entries . 46
Figure 34 – Combination with an implicitly mapped dictionary entry . 47
Figure 35 – Subdevices . 49
Figure 36 – Subdevices example . 51

Table 1 – Alarm properties mapping. 29
Table 2 – Implicit Type Casts . 47

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IEC 62769-8:2023 © IEC 2023 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

®
FIELD DEVICE INTEGRATION (FDI ) –

Part 8: EDD to OPC-UA Mapping

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
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Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 62769-8 has been prepared by subcommittee 65E: Devices and integration in enterprise
systems, of IEC technical committee 65: Industrial-process measurement, control and
automation. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
65E/851/CDV 65E/909/RVC

Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

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– 6 – IEC 62769-8:2023 © IEC 2023
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts in the IEC 62769 series, published under the general title Field device
®
), can be found on the IEC website.
integration (FDI
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The "colour inside" logo on the cover page of this document indicates that it
contains colours which are considered to be useful for the correct understanding of its
contents. Users should therefore print this document using a colour printer.

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IEC 62769-8:2023 © IEC 2023 – 7 –
®
FIELD DEVICE INTEGRATION (FDI ) –

Part 8: EDD to OPC-UA Mapping



1 Scope
This part of IEC 62769 specifies how the internal view of a device model represented by the
EDD can be transferred into an external view as an OPC-UA information model by mapping
EDD constructs to OPC-UA objects.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
NOTE For undated references, the edition of the referenced document (including any amendments), which applies
®1 ®
for a specific FDI Technology Version is defined within the FDI Technology Management Document and on the
support portals of FieldComm Group and PI International.
IEC 61804-3, Devices and integration in enterprise systems − Function blocks (FB) for process
control and electronic device description language (EDDL) − Part 3: EDDL syntax and
semantics
IEC 62541-3, OPC Unified Architecture – Part 3: Address Space Model
IEC 62541-4, OPC Unified Architecture – Part 4: Services
IEC 62541-5, OPC Unified Architecture – Part 5: Information Model
IEC 62541-8, OPC Unified Architecture – Part 8: Data Access
IEC 62541-9:2020, OPC Unified Architecture – Part 9: Alarms and Conditions
OPC 10000-17, OPC Unified Architecture – Part 17: Alias Names
OPC 10000-19, OPC Unified Architecture – Part 19: Dictionary Reference
IEC 62541-100, OPC unified architecture – Part 100: Device Interface
®
IEC 62769-1, Field Device Integration (FDI ) – Part 1: Overview
® ®
IEC 62769-5, Field Device Integration (FDI ) – Part 5: FDI Information Model
® ®
IEC 62769-6, Field Device Integration (FDI ) – Part 6: FDI Technology Mappings
___________
1 ®
 FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given
for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark
holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires
permission of the trade name holder.

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– 8 – IEC 62769-8:2023 © IEC 2023
ISO/IEC 11179-6, Information technology – Metadata registries (MDR) – Part 6: Registration
OPC 30081, Process Automation Devices – PADIM
UN/CEFACT, UNECE Recommendation 20, Codes for Units of Measure Used in International
Trade
available at https://www.unece.org/cefact/codesfortrade/codes_index.html [viewed 2023-02-07]
3 Terms, definitions, abbreviated terms, acronyms and conventions
3.1 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 62769-1,
IEC 62769-5, IEC 62769-6, IEC 62541-3, IEC 62541-4, IEC 62541-5, IEC 62541-8,
IEC 62541-9, OPC 10000-17, IEC 62541-100, and OPC 30081 apply.
ISO and IEC maintain terminology databases for use in standardization at the following
addresses:
• IEC Electropedia: available at https://www.electropedia.org/
• ISO Online browsing platform: available at https://www.iso.org/obp
3.2 Abbreviated terms and acronyms
For the purposes of this document, the abbreviated terms and acronyms given in IEC 62769-1
as well as the following apply.
PA-DIM Process Automation Device Information Model
3.3 Conventions
3.3.1 Capitalization
®
Capitalization of the first letter of words is used in the IEC 62769 series to emphasize an FDI
defined term.
3.3.2 Graphical notation
OPC UA defines a graphical notation for an OPC UA AddressSpace. It defines graphical
symbols for all NodeClasses and how different types of References between Nodes can be
visualized. Figure 1 shows the symbols for the NodeClasses used in this document.
NodeClasses representing types always have a shadow.

Figure 1 – OPC UA Graphical notation for NodeClasses

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IEC 62769-8:2023 © IEC 2023 – 9 –
Figure 2 shows the symbols for the ReferenceTypes used in this document. The Reference
symbol is normally pointing from the source Node to the target Node. The only exception is the
HasSubType Reference. The most important References such as HasComponent, HasProperty,
HasTypeDefinition and HasSubType have special symbols avoiding the name of the Reference.
For other ReferenceTypes or derived ReferenceTypes, the name of the ReferenceType is used
together with the symbol.

Figure 2 – OPC UA Graphical notation for References
Figure 3 shows a typical example for the use of the graphical notation. Object_A and Object_B
are instances of the ObjectType_Y indicated by the HasTypeDefinition References. The
ObjectType_Y is derived from ObjectType_X indicated by the HasSubType Reference. The
Object_A has the components Variable_1, Variable_2 and Method_1.
To describe the components of an Object on the ObjectType, the same NodeClasses and
References are used on the Object and on the ObjectType such as for ObjectType_Y in the
example. The Nodes used to describe an ObjectType are instance declaration Nodes.
To provide more detailed information for a Node, a subset or all Attributes and their values can
be added to a graphical symbol (see for example Variable_1, the component of Object_A in
Figure 3).

Figure 3 – OPC UA Graphical notation example

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To improve readability, this document frequently includes the type name inside the instance
box rather than displaying both boxes and a reference between them. This optimization is shown
in Figure 4.

Figure 4 – Optimized Type Reference
4 Overview
There are two types of mapping mechanisms – explicit and implicit mapping. Explicit mapping
is provided by the EDD constructs SEMANTIC_MAP in combination with COLLECTIONS,
METHODS
...